• Bondztek was founded in 2007 with a team of expertise in semiconductor assembly equipment. Over the years, Bondztek has grown to become a leader in refurbishment of die attach and wire bond equipment, supporting the semiconductor industry in extending equipment lifespan.

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• We are focusing on Semiconductor Backend industry, offering a complete solutions in our core segment – DA/WB. We provide a turn-key solution which includes refurbishment, retrofit/conversion kit, spare part and field service support. Core brands that we support are ESEC, Datacon, Delvotec, K&S, Shinkawa, ASM, DISCO, Dage,…etc.

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• Our technical team are with 30+ years of DA/WB expertise who has worked in technical position in OEM company.

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• Bondztek, headquartered in Melaka, Malaysia, operate from it’s own factory building that store stock refurbished equipment, the facility in Melaka includes also a refurbishment workshop with a customer buyoff lab.