Manufacturer: ESEC Type: Die Bonder Model: ESEC 2008XP3 Description: ESEC 2008XP3 Die BonderESEC 2008XP3SKU: ESEC 2008XP3Brand*SelectQuantity*Contact Us to PurchasePRODUCT INFOManufacturer: ESECType: Die BonderModel: ESEC 2008XP3Description: ESEC 2008XP3 Die BonderSHIPPING INFOEx-Works.KEY FEATURESMultiple units available.Handle up to 300mm wafer.Configuration according to customer request.