Bondztek was founded in 2007 with a team of expertise in semiconductor assembly equipment. Over the years, Bondztek has grown to become a leader in refurbishment of die attach and wire bond equipment, supporting the semiconductor industry in extending equipment lifespan.

We are focusing on Semiconductor Backend industry, offering a complete solutions in our core segment – DA/WB. We provide a turn-key solution which includes refurbishment, retrofit/conversion kit, spare part and field service support. Core brands that we support are ESEC, Datacon, Delvotec, K&S, Shinkawa, ASM, DISCO, Dage,…etc.

Our technical team are with 30+ years of DA / WB expertise who has worked in technical position in OEM company. Bondztek,  headquartered in Melaka, Malaysia, operates from it's own factory building that store stock refurbished equipment, the facility Melaka includes also refurbishment workshop with a customer buyoff lab.