Company Overview
Bondztek Equipment Sdn. Bhd., established in 2007, is a specialised provider of semiconductor backend solutions, focusing on equipment refurbishment, technical support, and integrated engineering services. With a strong foundation built by ex-OEM professionals, the company brings over 30 years of hands-on experience in die attach, wire bonding, and test handler technologies, serving a wide range of global semiconductor manufacturers.
The company is recognised for its expertise in extending the lifecycle of semiconductor equipment, particularly for obsolete and legacy platforms. Through refurbishment, retrofit, spare parts support, and on-site technical services, Bondztek delivers practical and cost-effective solutions that enhance equipment performance, reliability, and long-term operational value. Its strong support for leading brands such as ESEC, ASM, K&S, ISMECA, and DATACON further strengthens its industry credibility.
In addition to refurbishment and support services, Bondztek continues to expand its capabilities through in-house product development, factory automation integration, and strategic partnerships with equipment manufacturers. By combining innovation, engineering expertise, and industry collaboration, Bondztek is committed to delivering efficient, reliable, and future-ready semiconductor solutions that support evolving production demands worldwide.
Vision
Mission
Core Value
Why Choose Us
Integrated Equipment Lifecycle Solutions
Cost-Effective Engineering Alternatives
Customization & Retrofit Expertise
Reliable Technical Support & Service
Value Recovery Through Trade-In Programs
Ready Stock Refurbished Equipment in Melaka
Bondztek Milestone
Established office/warehouse in Malaysia
Establish of Bondztek Philippines