Contact to Our Team
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| Specification | Details |
|---|---|
| Die Attach Type | 双摆臂/Eutectic |
| Bonding Accuracy | ≤ ±38 µm θ < ±3° |
| UPH | Max 24K |
| Wafer Size | 8 inch (6 inch) |
| MAP | YES |
| DAF | - |
| Die Size | 0.2*0.2 ~ 1 × 1 mm |
Contact us using the form below, and our team will respond promptly to assist with your enquiry.