Contact to Our Team
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| Specification | Details |
|---|---|
| Die Attach Type | Soft Solder |
| Bonding Accuracy | ≤ ±50 µm θ < ±3° |
| UPH | 4K ~ 8K |
| Wafer Size | 12 inch (8 inch) |
| MAP | YES |
| DAF | - |
| Die Size | 0.5*0.5 ~ 14 × 14 mm |
Contact us using the form below, and our team will respond promptly to assist with your enquiry.